@typecad/mcu-esp32s3
v1.0.0-alpha.3
Published
TypeCAD MCU definition for ESP32-S3 — datasheet pins, peripheral capabilities, and HAL instances
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@typecad/mcu-esp32s3
MCU definition package for the ESP32-S3 (dual-core Xtensa LX7 @ 240 MHz, Wi-Fi 4 + BLE 5, native USB-OTG). Provides datasheet-level pin definitions, hardware peripheral descriptions, and HAL instances used by the TypeCAD transpiler and board packages.
Purpose
MCU packages are the silicon layer — they define what pins exist on the chip and what peripherals are built into the silicon, independent of any board or framework. Board packages (e.g. @typecad/board-esp32s3) import from here and add board-specific aliases.
What's inside
src/pins.ts— OnePin.fromPort()export per GPIO:GPIO0–GPIO48src/peripherals.ts— Hardware peripheral descriptions (I2C, SPI, UART, ADC, timers, PWM) and auto-generated HAL instances (I2C0,SPI0,UART0,ADC)src/mcu.ts—MCU_PERIPHERALSmanifest consumed by board packages
ESP32-S3 peripheral summary
| Peripheral | Count | Notes | |---|---|---| | UART | 3 | USART0–2 | | I2C | 2 | I2C0–1 (GPIO matrix) | | SPI | 4 | SPI0–3 | | ADC | 2 | ADC1 (10 channels), ADC2 (10 channels), 12-bit | | Timers | 4 | 64-bit general-purpose timers | | PWM (LEDC) | 8 channels | 4 high-speed + 4 low-speed | | USB-OTG | 1 | Native USB 2.0 full-speed PHY |
How board packages use this
// In @typecad/board-esp32s3
export * from '@typecad/mcu-esp32s3'; // silicon pins + peripherals
export * from '@typecad/hal'; // HAL utilities (delay, Pin, etc.)Related packages
@typecad/board-esp32s3— board package using this MCU@typecad/hal— hardware abstraction layer@typecad/mcu-atmega328p— example of a fully-documented MCU package
License
MIT
